Understanding Critical PCB Impedance Discontinuity Issues

 Achieving flawless high-speed performance begins with recognizing how PCB impedance discontinuity affects signal behavior. When a trace’s characteristic impedance changes due to bends, vias, connectors, or width variations, reflections and signal distortion can occur. These disruptions weaken signal integrity and reduce the reliability of fast digital communication. Engineers must analyze impedance profiles using TDR tools to locate mismatches and correct layout flaws. Controlling stack-up, maintaining consistent trace geometry, and minimizing abrupt transitions are essential steps to reducing PCB impedance discontinuity. It provides the advanced testing solutions needed to detect and resolve these issues effectively.


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